Title:
EPOXY RESIN COMPOSITION AND ITS CURED MATTER
Document Type and Number:
Japanese Patent JP2004269615
Kind Code:
A
Abstract:
To provide an epoxy resin composition which gives a cured matter excellent in heat resistance and breaking toughness and used for a sealing material, an adhesive, an insulating protective material, and the like, for highly densified semiconductor elements, flexible substrates, laminated boards/multilayer boards, and the like.
The epoxy resin composition comprises (a) an epoxy resin, (b) a curing agent, and (c) a phenolic hydroxyl group-containing polyamide-poly(butadiene-acrylonitrile) copolymer.
Inventors:
MOGI SHIGERU
AKATSUKA YASUMASA
UCHIDA MAKOTO
ISHIKAWA KAZUNORI
AKATSUKA YASUMASA
UCHIDA MAKOTO
ISHIKAWA KAZUNORI
Application Number:
JP2003059860A
Publication Date:
September 30, 2004
Filing Date:
March 06, 2003
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
C08G59/62; C08G59/32; (IPC1-7): C08G59/62; C08G59/32