Title:
エポキシ樹脂組成物およびその硬化物
Document Type and Number:
Japanese Patent JP6789936
Kind Code:
B2
Abstract:
Provided is an epoxy resin composition that has well-balanced copper foil adhesiveness, mechanical strength, heat resistance and dielectric characteristics (in particular, relative permittivity and dielectric tangent) and is useful in printed wiring boards for electronic appliances, etc. Also provided is a cured product using the epoxy resin composition. The epoxy resin composition comprises a maleimide resin represented by formula (1) and an epoxy resin, wherein the content of the polymaleimide resin is 5-50 wt% relative to the total resin amount in the composition. In formula (1): Rs exist independently and represent a hydrogen atom or an alkyl or aromatic group having 1-5 carbon atoms; a is 1-4; b is 1-3; and n is an integer that satisfies the requirement 1 < the average value of n ≤ 5.
Inventors:
Kazuki Matsuura
Nakanishi Masataka
Nakanishi Masataka
Application Number:
JP2017524965A
Publication Date:
November 25, 2020
Filing Date:
June 23, 2016
Export Citation:
Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA
International Classes:
C08L35/00; C08G59/40; C08L63/00
Domestic Patent References:
| JP2009001783A | ||||
| JP2014037485A | ||||
| JP2005163014A | ||||
| JP7330831A |
Foreign References:
| WO2015152007A1 | ||||
| WO2016072404A1 |
Attorney, Agent or Firm:
Shinei Patent Office