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Patent Searching and Data


Title:
EPOXY RESIN, EPOXY RESIN COMPOSITION AND ITS CURED MATERIAL
Document Type and Number:
Japanese Patent JPH10147629
Kind Code:
A
Abstract:

To obtain an epoxy resin excellent in reactivity, hardly causing blocking during storage, useful as an adhesive, etc., by specifying an epoxy equivalent and a hydrolyzable chlorine amount.

This epoxy resin of formula I ((n) is an average value and is a positive number of 0 to 1; G is glycidyl) has ≤190g/eq epoxy equivalent and ≤500ppm hydrolyzable chlorine amount. The epoxy resin is obtained, for example, by reacting a dissolved mixture of a compound of formula II, an excessive amount of an epihalohydrin such as epichlorohydrin or epibromohydrin and an aprotic polar solvent at 20-120°C for 0.5-10 hours by adding an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide.


Inventors:
AKATSUKA YASUMASA
HASEGAWA RYOICHI
Application Number:
JP31850096A
Publication Date:
June 02, 1998
Filing Date:
November 15, 1996
Export Citation:
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Assignee:
NIPPON KAYAKU KK
International Classes:
C08K3/00; C08G59/24; C08G59/40; C08L63/00; (IPC1-7): C08G59/24; C08G59/40; C08K3/00; C08L63/00