To provide an epoxy resin composition, having excellent flame retardance, heat resistance and moisture resistance, and suitably usable for a resin composition for a printed wiring board, a resin composition for a sealing material of an electronic component, a resist ink, an electroconductive paste, a coating material, an adhesive, a composite material or the like; and to provide a laminate using the composition.

The epoxy resin composition comprises a modified epoxy resin obtained by reacting (A) an epoxy resin having an aromatic polycyclic skeleton obtained by bonding two aromatic hydrocarbons at two neighboring substitution positions on the aromatic rings in the aromatic hydrocarbons through carbon atoms and/or oxygen atoms, and glycidyloxy groups as substituents on the aromatic polycyclic skeletons, and (B) a phenolic compound having two aromatic hydroxy compounds directly bonded to each other, and a polyfunctional aromatic polyester resin. The laminate is obtained by using the epoxy resin composition.