Title:
EPOXY RESIN COMPOSITION AND EPOXY RESIN COMPOSITION FOR LAMINATED BOARD
Document Type and Number:
Japanese Patent JP3391067
Kind Code:
B2
Abstract:
PURPOSE: To obtain an epoxy resin composition comprising a specific epoxy resin, a curing agent, and a curing accelerator, giving cured products excellent in appearance, heat resistance and low water absorbability, and useful for electric laminated boards insulating powder coatings, etc.
CONSTITUTION: This resin composition comprises (A) an epoxy resin having a structure in which aromatic groups are bonded to each other through alicyclic hydrocarbon groups each having a cyclohexane ring, a cyclohexene ring, etc., in the skeleton as binding groups and in which the aromatic groups have been substituted with glycidyloxy groups, and having a Gardner color number of ≤10 in a dioxane solution having a non-volatile content of 50wt.%, e.g. an epoxy resin obtained by reacting an epihalohydrin with a phenol resin obtained by reacting an unsaturated cyclic hydrocarbon compound such as vinylcyclohexene with an OH group-containing compound such as a phenolic compound in the presence of an acidic ion exchange resin, (B) a curing agent, and (C) a curing accelerator.
Inventors:
Hiroshi Kameyama
Ichiro Ogura
Katsuji Takahashi
Ichiro Ogura
Katsuji Takahashi
Application Number:
JP30394293A
Publication Date:
March 31, 2003
Filing Date:
December 03, 1993
Export Citation:
Assignee:
Dainippon Ink and Chemicals Co., Ltd.
International Classes:
C08L63/00; C08G59/08; C08G59/20; C08G59/24; C08G59/30; C08G61/02; C08J5/24; H01L23/29; H01L23/31; H05K1/03; (IPC1-7): C08G59/08; C08G59/24
Domestic Patent References:
| JP5301946A | ||||
| JP4168122A | ||||
| JP4170424A |
Attorney, Agent or Firm:
Victory Takahashi
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