PURPOSE: To provide an epoxy resin composition which comprises an epoxy resin, a curing agent, when needed, a curing accelerator, thus is useful in electri cal insulating plate or printed circuit plate because it has a specific viscosity and gel time, solidifies at room temperature and can give nonsolvent prepreg.
CONSTITUTION: An epoxy resin (for example, brominated bisphenol-A epoxy resin), a curing agent (for example, phenol novolak resin) and, when needed, a curing accelerator (for example, 2-methylimidazole) are formulated to give an epoxy resin composition for non-solvent type laminate plates having more than 10 minutes gel time at 150°C. Then, this epoxy resin is heated at 50-200°C to adjust its viscosity to 0.5-20 poise, and glass cloth or glass nonwoven fabric are impregnated with the epoxy resin, as the epoxy resin is tentatively cured to control the tentative curing so that the gel time becomes 3-15 minutes at 150°C, whereby this prepreg for laminated plates such as electric insulating plates or printed circuit plates are obtained.
HAMAGUCHI MASAHIRO
UENO HARUO
AKATSUKA YASUMASA
KUBOKI KENICHI
