EPOXY RESIN COMPOSITION AND METHOD FOR PRODUCING INSULATED ELECTRIC AND ELECTRONIC COMPONENT

Japanese Patent JP2006257270

A

To obtain an epoxy resin composition that has excellent adhesiveness to parts, high Tg and excellent insulation properties and heat resistance, especially an epoxy resin composition that has improved adhesiveness to a substrate containing a carboxy group as an object substrate and yet high Tg and excellent insulation properties and heat resistance and to provide a method for producing electric and electronic parts insulated by using the epoxy resin composition.

Th epoxy resin composition comprises at least (a) an epoxy resin, (b) an acid anhydride, (c) a curing promoter composed of imidazole and its derivative and (d) a crystal nucleating agent for a substrate containing a carboxy group. The method for producing electric and electronic parts insulated by using the epoxy resin composition is provided.

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FUJII TETSUYA
YASU KATSUHIKO
HARA NAOKI

JP2005076979A

September 28, 2006

March 17, 2005

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HITACHI CHEMICAL CO LTD

C08L63/00; C08K3/00; C08K5/00; H01L23/29; H01L23/31

JP2002121351A	2002-04-23
JPH08239376A	1996-09-17
JP2003026989A	2003-01-29

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