PURPOSE: The titled composition, consisting of an epoxy resin containing a specific novolak epoxy resin in a specified amount and a curing agent, having improved heat, crack and impact resistance, and suitable to particularly sealing molding materials for semiconductor integrated circuits.
CONSTITUTION: An epoxy resin composition obtained by incorporating an epoxy resin component containing 15wt% or more novolak epoxy resin obtained by reacting epichlorohydrin with a condensate of a phenol containing 2,2-bis(4'- hydroxyphenyl)-propane and if necessary a mono- or polyhydric phenol with an aldehyde, e.g. formaldehyde, with a curing agent, e.g. novolak resin, and if necessary a curing accelerator, e.g. dimethylbenzylamine, a filler, e.g. silica, a colorant, e.g. carbon, a flame retardant, e.g. antimony trioxide, etc.
| JPH02168259 | ELECTROPHOTOGRAPHIC SENSITIVE BODY |
| JPS58111868 | THERMOSETTING RESIN COMPOSITION |
| JPS61159635 | FORMATION OF IMAGE |
EBARA TOSHIHARU
NAKAMURA SHIYUUJI
MORI HIROMI
ARIGA NAGAROU
SEKIGUCHI HISAFUMI
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