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Title:
EPOXY RESIN COMPOSITION, PREPREG, RESIN-ATTACHED METAL FOIL. ADHESIVE SHEET, AND LAMINATION PLATE
Document Type and Number:
Japanese Patent JP2006016619
Kind Code:
A
Abstract:

To provide an epoxy resin composition which provides a halogen-free and excellently retardant cured product and an improved storage stability of a half-cured product, a prepreg, a resin-attached metal foil, an adhesive sheet, and a lamination plate which are prepared using the same epoxy resin composition.

The epoxy resin composition comprises a phosphorus-containing epoxy resin obtained by reacting at least one particular organic phosphorus compound with an epoxy resin, a curing agent, and an inorganic powdery filler, wherein the phosphorus-containing epoxy resin has a phosphorus content of 0.5-4.0 wt%, and the epoxy resin composition has an inorganic powdery filler content of 20-60 wt% in the total solid component. The epoxy resin composition is used to prepare the prepreg, the resin-attached metal foil, and the adhesive sheet. The prepreg, the resin-attached metal foil, and the adhesive sheet are used to prepare the lamination plate.


Inventors:
KAKIUCHI HIDETAKA
TAKADA TOSHIHARU
SAGARA TAKASHI
YAMANOUCHI KENGO
IHARA KIYOAKI
Application Number:
JP2005205875A
Publication Date:
January 19, 2006
Filing Date:
July 14, 2005
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08G59/14; B32B15/08; B32B15/092; C08J5/24; C09D163/00; C08L63/00
Domestic Patent References:
JPH11279258A1999-10-12
JPH023414A1990-01-09
JP2000080251A2000-03-21
JPH08188638A1996-07-23