Title:
エポキシ樹脂組成物、プリプレグ、及び繊維強化複合材料
Document Type and Number:
Japanese Patent JP7264237
Kind Code:
B2
Abstract:
An epoxy resin composition is provided which includes a poly-naphthalene-based epoxy resin having two or more epoxy groups per molecule combined with a non-linear multi-phenyl epoxy resin and an additional epoxy resin having an epoxy functionality of 3 or more, as well as a prepreg, and a fiber-reinforced composite material prepared using the epoxy resin composition. More specifically, an epoxy resin composition is provided which contains a combination of particular types of epoxy resins and curatives that, when cured, provides high flexural modulus and that is suitable for preparing a fiber-reinforced composite material capable of withstanding extreme use environments such as low-temperature environments and high-temperature moisture-absorbing environments. In addition, epoxy resin systems are provided which are capable of achieving a high Tg along with good thermal stability for long periods of time at elevated temperatures (e.g., 180° C. or more) when cured at 210° C. for 2 hours.
Inventors:
Swizen Saint Tan
Jonathan Hughes
Nobuyuki Arai
Jonathan Hughes
Nobuyuki Arai
Application Number:
JP2021512254A
Publication Date:
April 25, 2023
Filing Date:
September 20, 2019
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C08J5/24; C08G59/32; C08G59/50; C08L63/00
Domestic Patent References:
| JP2010202727A |
Foreign References:
| WO2016204173A1 | ||||
| WO2017038880A1 | ||||
| WO2017033056A1 | ||||
| WO2018073652A1 | ||||
| US20110049426 |
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