Title:
EPOXY RESIN COMPOSITION, PREPREG, AND LAMINATE
Document Type and Number:
Japanese Patent JPH083283
Kind Code:
A
Abstract:
PURPOSE: To obtain an epoxy resin composition and a prepreg each of which imparts excellent heat resistance to a laminate and to provide a laminate having excellent heat resistance.
CONSTITUTION: This resin composition comprises a solution obtained by heating a mixture comprising an epoxy resin containing two or more epoxy groups per molecule, dicyandiamide, and a solvent with a b.p. of 130°C or lower at 70-130°C to dissolve the resin and the dicyandiamide.
Inventors:
MORI HIRONOBU
SAITO EIICHIRO
SAITO EIICHIRO
Application Number:
JP14418494A
Publication Date:
January 09, 1996
Filing Date:
June 27, 1994
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08J5/24; B32B15/08; C08G59/18; C08G59/50; H05K1/03; (IPC1-7): C08G59/50; B32B15/08; C08G59/18; C08J5/24
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)
Next Patent: 軌道振り子式制振装置