To provide an epoxy resin composition capable of producing a laminated plate not generating harmful substances, having a low dielectric constant, a small dielectric tangent and flame retardant property, a prepreg by using the resin composition and the laminated plate prepared by using the prepreg.
This epoxy resin composition is characterized by containing a modified phenol product obtained by performing a re-distributing reaction of a polyphenylene ether resin with a phenolic compound in the presence of a free radical reaction initiator to make the number-average molecular weight of the product become 10-70% of the number-average molecular weight of the used polyhenylene ether resin, an epoxy resin, a curing agent for the epoxy resin and further a specific phosphorus compound. The prepreg obtained by using the epoxy resin composition and the laminated plate prepared by using the prepreg are also provided.
YONEMOTO KAMIO
KISHINO MITSUTOSHI
