PURPOSE: To provide an epoxy resin composition having excellent storage stability and curable at a low temperature, by compounding an epoxy resin with a liquid or semi-solid polyamide having terminal amino group together with a dicyandiamide hardener.
CONSTITUTION: The objective composition is prepared by compounding (A) an epoxy resin with (B) preferably 1W10 PHR of a dicyandiamide hardener, (C) preferably 1W15 PHR of a liquid or semi-solid polyamide having terminal amino group (a reactive thremoplastic resin obtained by the reaction of a polyamine with a dimer acid obtained by the dimerization of an unsaturated acid; the liquid resin has a viscosity of preferably 300W70,000 cps at 40°C, and the semi- solid resin has a softening point of preferably ≤50°C), and (D) a cure accelerator (preferably a urea compound or an imidazole compound). The amount of the component (D) is preferably 0.3W3 times volume of the component (B) and the ratio C/B is 0.1W5.
KOUGO YASUO
NAGATA YASUHISA
| JPS5853913A | 1983-03-30 |