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Title:
EPOXY RESIN COMPOSITION FOR PREPREG AND PREPREG
Document Type and Number:
Japanese Patent JPS62146917
Kind Code:
A
Abstract:

PURPOSE: To obtain a prepreg which can give a structure excellent in heat resistance, water resistance and impact resistance, by mixing the title composition obtained by mixing a specified epoxy resin with a curing agent such as dicyandiamide, etc., with a reinforcing fiber.

CONSTITUTION: The title composition is obtained by mixing an epoxy resin (A) comprising 100W30pts.wt. epoxy resin of formula I [wherein R is C(CH3)2∫X, SO2, CO, Y or the like, Y is O or S, Xis CH3 or Br and n is 0W2] and, optionally, 0W30pts.wt. other epoxy resins such as a bisphenol A epoxy resin with a curing agent (B) selected from among dicyandiamide (a), diaminodiphenyl sulfone (b) and a compound (c) of formula II [wherein r is a group of formula III (wherein Z is 3W6) or of formula IV or V] and, optionally, a thermoplastic resin (C) having a glass transition temperature ≥100°C and being soluble in the epoxy resin. The obtained composition is mixed with a reinforcing fiber (D) selected from among carbon, aramid, SIC, Al2O3, boron and WC fibers to obtain a prepreg.


Inventors:
SUZUE SHIGERU
HONDA SHIRO
MORIMOTO HIROSHI
Application Number:
JP28640285A
Publication Date:
June 30, 1987
Filing Date:
December 19, 1985
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08J5/24; C08G59/40; C08G59/50; (IPC1-7): C08G59/40; C08G59/50; C08J5/24



 
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