To provide an epoxy resin composition for sealing a semiconductor, which simultaneously satisfies requirements for moldability (flowability, filling properties, and curability) and reliability, particularly reliability in high- temperature reflowing, and a semiconductor device.
The epoxy resin composition comprises an epoxy resin (A), a curing agent (B) and an inorganic filler (C), wherein the curing agent (B) comprises a phenolic curing agent (b1) having an aminotriazine skeleton represented by general formula (I) (wherein R1's may be the same or different and are each H, a 1-4C lower alkyl group, or a phenyl group) in the molecule and wherein the epoxy resin (A) comprises an epoxy resin (a1) represented by general formula (II) (wherein R2 and R3 may be the same or different and are each H, a halogen atom, a 1-4C lower alkyl group, or a phenyl group).
KATSUTA SHINYA
SHIMIZU MICHIO
