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Title:
EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR, AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2001207034
Kind Code:
A
Abstract:

To obtain an epoxy resin composition used for sealing an optical semiconductor and excellent in clarity and resistance to soldering and to provide an optical semiconductor device sealed with a cured item of the composition.

The epoxy resin composition essentially comprises a reaction product of a phenolic compound having a specified structure and triglycidyl isocyanurate in a specified ratio, an acid anhydride curative, and a cure accelerator. The optical semiconductor device is prepared by sealing with a cured item of the composition.


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Inventors:
MIYAKE SUMIYA
KOMORI SHINJI
AKIYAMA MASAHITO
Application Number:
JP2000016307A
Publication Date:
July 31, 2001
Filing Date:
January 25, 2000
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L63/06; C08G59/42; H01L23/29; H01L23/31; (IPC1-7): C08L63/06; C08G59/42; H01L23/29; H01L23/31



 
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