To obtain the subject composition excellent in adhesion to an insert such as a semiconductor element or the like and mold releasability by compounding, as indispensable components, a specific epoxy resin, a phenol-based curing agent, a curing accelerator, a specific releasing agent and a specific amount of an inorganic filler.
The objective composition comprises, as indispensable ingredients, at least one epoxy resin represented by formula I or II (wherein (n) is at least 1), a phenol-based curing agent (e.g. a phenol resin), a curing accelerator (e.g. triphenyl phosphine), a releasing agent obtained by esterifying, using a 5C or higher monohydric alcohol, a copolymer of a 10C or higher α- olefin with maleic acid and having a number average mol.wt. of 1,000-20,000 and a softening temperature of not exceeding 100°C and a 70-95 wt.%, based on the total of the composition, of an inorganic filler (e.g. spherical fused silica). Preferably, as the releasing agent is jointly employed an oxidized or non- oxidized paraffin or a polyethylene-based releasing agent both having a number average mol.wt. of 500-20,000.
KAWADA TATSUO
KASHIWABARA TAKAYOSHI
HORIE TAKAHIRO
MIZUKAMI YOSHIHIRO
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