EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME

Title:

EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME

Document Type and Number:

Japanese Patent JP2007091814

Kind Code:

A

Abstract:

To provide an epoxy resin composition for sealing semiconductors, which reduces the quantity of curvature and is excellent in adhesiveness to metal portions.

This epoxy resin composition for sealing semiconductors comprises the following components (A) and (B). (A) Triglycidyl isocyanate. (B) A phenolic resin having alkylthio groups on the aryl skeleton.

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Inventors:

SUZUKI TOSHIMICHI
AKIZUKI SHINYA

Application Number:

JP2005280475A

Publication Date:

April 12, 2007

Filing Date:

September 27, 2005

Export Citation:

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Assignee:

NITTO DENKO CORP

International Classes:

C08G59/62; C08G8/10; C09K3/10; H01L23/29; H01L23/31

Attorney, Agent or Firm:

Masahiko Nishito
Iisaki Aika
Yuko Saito

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