Title:
EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2008201932
Kind Code:
A
Abstract:
To provide an epoxy resin composition for sealing semiconductors used for sealing semiconductor elements that is excellent in heat resistant reliability as well as in continuous moldability, and a semiconductor device obtained from the same.
The epoxy resin composition for sealing semiconductors comprises an epoxy resin, a curing agent and an inorganic filler, where the epoxy resin composition comprises as the curing agent a phenolic resin represented by formula (1) (wherein R1-R14 are each an atom or a group selected from among hydrogen atom, a hydroxy group and alkyl groups, and R1-R5, R6-R9 and R10-R14 each contain at least two hydroxy groups; and n is an integer of 0-3).
Inventors:
MINAMOTO TAKASHI
Application Number:
JP2007040789A
Publication Date:
September 04, 2008
Filing Date:
February 21, 2007
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08G59/62; H01L23/29; H01L23/31
Domestic Patent References:
| JPH08283536A | 1996-10-29 | |||
| JP2005002311A | 2005-01-06 | |||
| JPH0241353A | 1990-02-09 | |||
| JP2006176683A | 2006-07-06 | |||
| JP2007031698A | 2007-02-08 |
Attorney, Agent or Firm:
Etsushi Kotani
Takao Ito
Jiro Higuchi
Takao Ito
Jiro Higuchi
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