Title:
EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP2501071
Kind Code:
B2
Abstract:
PURPOSE: To obtain an epoxy resin composition for sealing a semiconductor element, excellent in heat resistance, moisture resistance, or the like, by adding a specified imide-epoxy resin to an epoxy resin composition containing an epoxy resin, a curing agent, a cure accelerator and an inorganic filler.
CONSTITUTION: The objective composition is obtained by mixing (A) an epoxy resin composition containing (1) an o-cresol novolak epoxy resin, (ii) a phenolic novolak curing agent (preferably having a softening point of 80-100°C, a hydroxyl equivalent of 100 to 120, and an impurity content of at most 10 ppm), (iii) a triphenylphosphine-base cure accelerator and (iv) an inorganic filler (preferably comprising a fused silica having a particle size of 10-30 μm) with (B) an imide- epoxy resin of the formula [wherein R1 and R2 are each H or (CH2)nCH3 (wherein (n) is 0 or an integer of 1 or greater)], preferably in an amount of about 0.1-20.0 wt.% based on the total resin composition.
Inventors:
KIN KANKEN
RI CHUN
RI CHUN
Application Number:
JP28118792A
Publication Date:
May 29, 1996
Filing Date:
October 20, 1992
Export Citation:
Assignee:
DAIICHI MOSHOKU KK
International Classes:
C08G59/62; C07D303/24; C07D405/14; C08G59/20; C08G59/28; C08G59/32; C08G59/40; C08G73/10; C08K3/00; C08L63/00; C08L63/04; C08L79/08; H01L23/29; H01L23/31; (IPC1-7): C08G59/20; C08G59/32; C08G59/40; C08G59/62; C08K3/00; C08L63/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Yamato Tsutsui
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