Title:
EPOXY RESIN COMPOSITION FOR SEALING OF SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP3415292
Kind Code:
B2
Abstract:
PURPOSE: To improve the fluidity, soldering crack resistance, low hygroscopicity, and heat resistance by incorporating a particular epoxy resin, an epoxy resin curing agent, an inorganic filler, and a curing accelerator.
CONSTITUTION: 20 to 90 pts.wt. 4,4'-bisphenol F epoxy resin of the formula I (wherein m is 0 to 0.5 on the average), 10 to 80 pts.wt. bisphenol epoxy resin of the formula II (wherein R is H, a 1-10C alkyl, a (substd.) phenyl, a (substd.) aralkyl, a 1-10C alkoxy, or a halogen, and n is m), an epoxy resin curing agent in an amt. of 0.5 to 2.0 mol, in terms of total amt. of groups reactive with the epoxy group, per mol of epoxy group in the whole epoxy resin component, 60 to 95wt.%, based on the whole compsn., inorg. filler, and 0.1 to 7wt.%, based on the epoxy resin, curing accelerator are mixed together.
Inventors:
Yasuyuki Murata
Junto Hayakawa
Norio Tsuiwa
Yoshinori Nakanishi
Junto Hayakawa
Norio Tsuiwa
Yoshinori Nakanishi
Application Number:
JP26814094A
Publication Date:
June 09, 2003
Filing Date:
October 07, 1994
Export Citation:
Assignee:
Japan Epoxy Resin Co., Ltd.
International Classes:
C08K3/00; C08G59/20; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/20; H01L23/29; H01L23/31
Domestic Patent References:
| JP3239718A | ||||
| JP3285909A | ||||
| JP356526A | ||||
| JP6147725A | ||||
| JP873563A | ||||
| JP6198644A | ||||
| JP6122751A |
Attorney, Agent or Firm:
Hideo Watanabe