PURPOSE: The titled composition having improved low stress properties, obtained by blending an epoxy resin with a specific amount based on the epoxy resin of a polyphosphazene consisting of a repeating unit shown by a specific structure, and adding a curing agent to the blend.
CONSTITUTION: An epoxy resin (e.g., bisphenol A type, etc.) and 5W20wt% based on the epoxy resin of a polyphosphazene consisting of a repeating unit shown by the formula (R is alkoxy group, or fluorine-containing organic compound residue) are dissolved in an organic solvent (e.g., tetrahydrofuran, etc.), blended, and the organic solvent is dried and removed. The prepared reaction product is kneaded with a curing agent (e.g., phenolic novolak resin, etc.), and, if necessary, a curing promoter, an inorganic filler (e.g., silica powder, etc.) by hot rolls, to give the aimed composition.
YONEDA YASUHIRO
FUKUYAMA SHUNICHI
MIYAGAWA MASASHI
MATSUURA AZUMA
