To provide an epoxy resin composition for sealing a semiconductor, having excellent preservability at high temperature and reliability in moist condition, and also having excellent characteristics of resistance to soldering.

This epoxy resin composition for sealing the semiconductor comprises (A) a biphenyl-type epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, (E) a compound having a dithiocarbonate group and (F) an amine compound. The content of the compound having the dithiocarbonate group is 0.01-0.5 wt.% and the content of the amine compound is ≤0.01 wt.% based on the whole epoxy resin composition.