To obtain a novel epoxy resin composition suitably employable for sealing a semiconductor, which gives a cured product excellent in thermal shock resistance and humidity resistance reliability, and gives a highly reliable semiconductor device even when surface-mounted on a circuit board, and to provide a semiconductor device sealed with the cured product of the resin composition.
The epoxy resin composition comprises as essential ingredients (A) an epoxy resin, (B) a curing agent and (C) a silicone-modified epoxy resin represented by average compositional formula (1) (wherein R1 is hydrogen atom or a 1-4C alkyl group; R is a substituted or unsubstituted monovalent hydrocarbon group containing no aliphatic unsaturated group; X is a divalent organic group; (k) and (m) are each a positive number satisfying 0≤k≤100, 0<m≤100 and 0<k+m≤200; and (n) is an integer of 0-400). The semiconductor device is sealed with the cured product of the epoxy resin composition. The epoxy resin composition is excellent in molding properties and gives the cured product excellent in thermal shock resistance and humidity resistance reliability. The semiconductor device sealed with the cured product of the epoxy resin composition is excellent in thermal shock resistance and humidity resistance reliability and is especially useful in industries.
ASANO HIDEKAZU
Saori Shigematsu
Katsunari Kobayashi
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