To obtain an epoxy resin composition that does not cause peeling off from an Ni-containing lead frame when subjected to soldering treatment after moisture absorption and is excellent in soldering resistance, and to provide a semiconductor device.

The semiconductor sealing epoxy resin composition comprises (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) an o,o'-dibenzamide diphenyldisulfide as the essential components wherein the o,o'-dibenzamide diphenyldisulfide is preferably contained in an amount of 0.005-2 wt% based on the total epoxy resin composition. The semiconductor device is produced by sealing a semiconductor element using the epoxy resin composition.