Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SEALED THEREWITH
Document Type and Number:
Japanese Patent JPH09124907
Kind Code:
A
Abstract:
To obtain an epoxy resin composition which can give a cured product excellent in humidity resistance and soldering-heat resistance by using a specified epoxy resin and a specified naphtholaralkyl resin.
This resin composition essentially consists of a diphenylmethane- skeleton-containing epoxy resin represented by formula I, a naphtholaralkyl resin represented by formula II (wherein (n) is 0 or an integer of 1 or greater), 25-93wt.%, based on the resin composition, inorganic filler and a cure accelerator.
Inventors:
ENOMOTO KATSUKO
Application Number:
JP31012095A
Publication Date:
May 13, 1997
Filing Date:
November 02, 1995
Export Citation:
Assignee:
TOSHIBA CHEM CORP
International Classes:
C08K3/00; C08G59/20; C08G59/24; C08L61/04; C08L63/02; H01L23/29; H01L23/31; (IPC1-7): C08L63/02; C08G59/24; C08K3/00; C08L61/04; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Eiji Morota
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