PURPOSE: To provide the titled resin composition containing a polyfunctional epoxy compound and a specific phthalocyanine tetramine compound, giving a cured material having excellent heat-resistance, moisture-resistance and corrosion resistance and suitable for semiconductor device.

CONSTITUTION: The objective composition contains (A) a polyfunctional epoxy compound (e.g. bisphenol A diglycidyl ether) and (B) a 4,4',4",4'''-phthalocyanine tetramine compound of formula (M is none, Cu, Pb, Fe, Ni or Co) (e.g. 4,4',4",4'''-phthalocyanine tetramine copper). A semiconductor device is produced by sealing or covering at least a part of a semiconductor element with the composition.