Title:
半導体封止用エポキシ樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP3562565
Kind Code:
B2
Inventors:
Kazuhiro Arai
Kazutoshi Tomiyoshi
Toshio Shiobara
Kazutoshi Tomiyoshi
Toshio Shiobara
Application Number:
JP37631798A
Publication Date:
September 08, 2004
Filing Date:
December 22, 1998
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08K3/00; C08G59/32; C08G59/62; C08G59/68; C08K5/54; C08K5/541; C08K5/544; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/32; C08G59/62; C08G59/68; C08K3/00; C08K5/541; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP1158755A | ||||
| JP1171253A | ||||
| JP9255812A | ||||
| JP6179736A | ||||
| JP5021651A | ||||
| JP2011617A | ||||
| JP9124905A | ||||
| JP10279663A | ||||
| JP11106612A | ||||
| JP10279661A |
Attorney, Agent or Firm:
Takashi Kojima
Yuko Nishikawa
Yuko Nishikawa