半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置

Title:

半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置

Document Type and Number:

Japanese Patent JP4237600

Kind Code:

B2

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Inventors:

Atsushi Hayakawa
Akihiro Ito

Application Number:

JP2003352233A

Publication Date:

March 11, 2009

Filing Date:

October 10, 2003

Export Citation:

Assignee:

Japan Epoxy Resin Co., Ltd.

International Classes:

C08G59/24; C08K3/00; C08G59/62; C08L63/00; H01L23/29; H01L23/31

Domestic Patent References:

Attorney, Agent or Firm:

Kanaya
Akira Inoue
Hiroshi Nakamoto

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