To obtain an epoxy resin composition for sealing a semiconductor, having excellent fluidity during a sealing molding, curability, mold release characteristics and continuous moldability and hardly causing an appearance stain and a mold stain of a resin cured product even when the amount of an inorganic filler mixed is increased.

The epoxy resin composition for sealing a semiconductor comprises (A) an epoxy resin, (B) a phenol resin-based curing agent, (C) an inorganic filler, (D) a curing promoter and (E) a mold release agent. The curing promoter (D) comprises a curing promoter (D1) having a cationic part and a silicate anionic part. The mold release agent (E) comprises a trimethylolpropane trifatty acid ester (E1) and/or a complex full ester (E2) of trimethylolpropane, a fatty acid and a dicarboxylic acid.

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