Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND SEMICONDUCTOR DEVICE SEALED THEREWITH
Document Type and Number:
Japanese Patent JP2000080155
Kind Code:
A
Abstract:

To obtain an epoxy resin composition having improved curability, moldability, and storage stability by incorporating an epoxy resin with a phenolic resin curing agent, a curing catalyst, and an inorganic filler.

The epoxy resin used is, for example, a phenol novolac epoxy resin. The phenolic resin curing agent used is for example, a phenol novolac resin. The curing agent is used to accelerate the curing reaction of the epoxy resin with the curing agent. The curing catalyst is a quat. phosphorus compound represented by the formula (wherein R1s and R2s are the same or different groups selected among 1-4C alkyls and 1-4C alkoxyls; m and n are each an integer of 1-3; a is an integer of 1-3; and b is an integer of 1-4). The amount of the curing catalyst is desirably 0.5-50 pts.wt. per 100 pts.wt. total amount of the epoxy resin and the curing agent. The inorganic filler chiefly used is, for example, ground spherical fused silica.


Inventors:
OHASHI KENJI
ISHIZAKI TATSUYA
UMENO MASAYUKI
ASANO HIDEKAZU
TOMIYOSHI KAZUTOSHI
OSADA MASAKAZU
SHIOBARA TOSHIO
Application Number:
JP28723298A
Publication Date:
March 21, 2000
Filing Date:
September 24, 1998
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HOKKO CHEM IND CO
SHINETSU CHEMICAL CO
International Classes:
C08K3/00; C08G59/68; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/68; C08K3/00; C08L63/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Takashi Kojima (1 person outside)