Title:
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND A SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3712045
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which composition is excellent in flame resistance and moisture resistance, gives a cured material having an excellent soldering-crack resistance and has no bad influences on human bodies and the environment.
SOLUTION: This composition contains (A) an epoxy resin, (B) a phenol resin curing agent, (C) a molybdenum compound, (D) a silicon-containing compound selected from (D-i) a polyorganosiloxane of formula I: R1aSiO(4-a)/2 (wherein R1 is a monovalent hydrocarbon group; and (a) is 0.8-3), (D-ii) an organosiloxane cured material and (D-iii) a block copolymer obtained by applying an additional reaction of a silicon-atom-bonding hydrogen atom of an organosiloxane of formula II: HmR2nSiO(4-m-n)/2 (wherein R2 is a monovalent hydrocarbon group; (m) is 0.001-0.2; and (n) is 1.8-2.1) onto an epoxy group of an epoxy resin or an alkenyl group of an alkenyl-group-containing epoxy resin, and (E) an inorganic filler.
Inventors:
Shoichi Nagata
Eiichi Asano
Shigeki Ino
Takayuki Aoki
Kazutoshi Tomiyoshi
Toshio Shiobara
Eiichi Asano
Shigeki Ino
Takayuki Aoki
Kazutoshi Tomiyoshi
Toshio Shiobara
Application Number:
JP2000114101A
Publication Date:
November 02, 2005
Filing Date:
April 14, 2000
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L63/00; C08G59/14; C08G59/18; C08G59/62; C08G77/38; C08G77/42; C08K3/00; C08K3/10; C08K3/24; C08K9/02; C08L83/04; C08L83/10; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/14; C08G59/18; C08G59/62; C08G77/38; C08G77/42; C08K3/00; C08K3/10; C08K3/24; C08K9/02; C08L83/04; C08L83/10; H01L23/29; H01L23/31
Domestic Patent References:
| JP11021432A | ||||
| JP11012436A | ||||
| JP10195280A |
Attorney, Agent or Firm:
Takashi Kojima
Yuko Nishikawa
Yuko Nishikawa