PURPOSE: To obtain a resin composition for semiconductor sealing, which is superior in heat resistance, flexibility, humidity resistance and crack resistance, by a method wherein a phenolic novolak resin, a vinyl group-containing silicon compound and the like, which respectively have a constant prescribed amount to the amount of an epoxy resin being arranged in the base material for the resin composition, are arranged in the base material.
CONSTITUTION: A base material containing 100 pts.wt. of an epoxy resin containing two or more of epoxy groups in one molecule, 50 to 150 pts.wt. of a phenolic novolak resin which is shown by the formula I (the (n) in the formula is an integer of 0 to 10), 200 to 100 pts.wt. of an inorganic filler and 5 to 50 pts.wt. of a vinyl group-containing silicon compound, which is shown by the formula II (the ratio of n:m in the formula is a ratio of 0.2:1 to 2:1), in a weight ratio is used as an epoxy resin composition for semiconductor sealing use. In particular, by blending the vinyl group-containing silicon compound in the resin composition as a flexibility imparting agent to a resin for semiconductor sealing, the elastic coefficient of a hardened material is reduced and the stress of the hardened material can be reduced.
TAKIGAWA YUKIO
YAGI SHIGEAKI
SARUWATARI NORIO
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