To obtain an epoxy resin compsn. for semiconductor sealing which is excellent in close filling of packages and resistance to soldering heat and has a low water absorption by compounding an epoxy resin with a specific curative and a specified amt. of an inorg. filler.
This compsn. contains an epoxy resin component contg. an epoxy resin represented by formula I (wherein R1 to R8 is H, 1-4C alkyl, or halogen) pref. in an amt. of 50wt.% or higher, pref. 70wt.% or higher, pref. in an amt. of the component of 0.05-14wt.% based on the compsn., a curative essentially contg. a polymer obtd. by reacting a fused polycyclic arom. compd. having at least three benzene rings (e.g. a compd. represented by formula II), a phenolic compd. (e.g. phenol), and an aldehyde (e.g. HCHO) pref. in an amt. of the curative of 0.5-15wt.% based on the compsn., and an inorg. filler (e.g. amorphous silica) in an amt. of 84-95wt.% based on the compsn.
TSURUMI YUMIKO
TANAKA MASAYUKI
