Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR SEALING DEVICE
Document Type and Number:
Japanese Patent JPH1135801
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in moisture resistance, solder resistance, moldability and fluidity, and hardly causing peeling, etc., of the sealing resin from a semiconductor chip, etc., by using a specific epoxy resin and a specified silane coupling agent. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin of formula I [(n) is 0 or not less than 1], (B) a phenol resin having two or more phenolic hydroxy groups capable of reacting with the epoxy group of the component A (e.g. a compound of formula II), (C) a silane coupling agent of the formula, R<1> -Cn H2n -Si(OR<2> )3 (R<1> is an atomic group having epoxy group or amino group; R<2> is methyl or ethyl), (e.g. a compound of formula III), (D) 25-92 wt.% alumina powder having <=100) m maximum particle diameter, preferably having low impurity concentration, further having <=30 μm average particle diameter and coated with fused silica, and (E) about 0.01-5 wt.% hardening accelerator such as the phosphorus-based, imidazole-based or DBU-based one, etc.
Inventors:
OKAMOTO MASANORI
Application Number:
JP21003597A
Publication Date:
February 09, 1999
Filing Date:
July 18, 1997
Export Citation:
Assignee:
TOSHIBA CHEM CORP
International Classes:
C08K9/02; C08G59/08; C08G59/62; C08K5/54; C08K5/5419; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/08; C08G59/62; C08K5/54; C08K9/02; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Eiji Morota
Previous Patent: RESIN COMPOSITION AND RESIN-SEALED SEMICONDUCTOR DEVICE MADE BY USING THE SAME
Next Patent: LIQUID RESIN COMPOSITION FOR SEALING
Next Patent: LIQUID RESIN COMPOSITION FOR SEALING