Title:
EPOXY RESIN COMPOSITION FOR WIRING SUBSTRATE
Document Type and Number:
Japanese Patent JPH04342720
Kind Code:
A
Abstract:
PURPOSE:To obtain the subject composition, containing an epoxy resin, a polyfunctional-phenolic compound, an imidazole compound and a specified copolymer and excellent in heat resistance, withstand voltage properties, mechanical characteristics and adhesion with hardly any occurrence of smear. CONSTITUTION:The objective composition containing (A) an epoxy resin, (B) a polyfunctional phenolic compound (blended in an amount of preferably 0.5-1.5 equiv. phenolic hydroxyl groups based on the epoxy resin), (C) an imidazole compound such as 2-ethylimidazole (blended in an amount of preferably 0.01-10wt.% based on the epoxy resin) and (D) preferably 1-15wt.% phenolic hydroxyl group-containing aramid-polybutadiene-acrylonitrile block copolymer expressed by the formula {x is 3-7; (y) is 1-4; [y/(x+y)] is 0.1-0.3; (z) is 5-15; (m) is 1-400; (n) is 1-400; [n/(n+m)] is 0.01-0.50; (1) is 1-50; Ar<1> and Ar<3> are containing bifunctional aromatic group}.
More Like This:
Inventors:
KIYOHARA TADASHI
Application Number:
JP14406591A
Publication Date:
November 30, 1992
Filing Date:
May 21, 1991
Export Citation:
Assignee:
TOMOEGAWA PAPER CO LTD
International Classes:
C08G59/40; C08G59/00; C08L53/00; C08L63/00; C08L87/00; H05K1/03; (IPC1-7): C08G59/40; C08L63/00; H05K1/03
Attorney, Agent or Firm:
Takeuchi Mamoru
Previous Patent: EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Next Patent: メタロセン類を用いて生じさせたポリマー類の流動修飾
Next Patent: メタロセン類を用いて生じさせたポリマー類の流動修飾