To increase a curing rate of an epoxy resin composition, which is useful as a semiconductor-sealing material, and suppress the formation of chlorine ions or the like, which causes an insulation failure and the corrosion of a circuit.
The epoxy resin composition comprises, as essential component, an epoxy resin, a phenolic resin, a 2-naphthylbenzimidazole compound of the following formula used as a cure promoter, and an inorganic filler wherein the cure promoter is compounded in an amount of 0.002 to 2.0 wt.% based on the total resin composition. In the formula, R1 represents, a hydrogen atom, an alkyl group, an aralkyl group or an alkenyl group, R2 represents a hydrogen atom, a lower alkyl group, a hydroxyl group, a lower alkoxy group, a carboxyl group or a lower dialkylamino group, and R3 represents a hydrogen atom or a lower alkyl group.
MIZOBE NOBORU
MURAI TAKAYUKI
YOSHIOKA TAKASHI
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