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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2004143368
Kind Code:
A
Abstract:

To provide an epoxy resin composition having excellent crack resistance.

The epoxy resin composition is composed of an epoxy resin mixture containing an epoxy resin, a hardener and a catalyst and a filler. The filler is produced by adding metal powder containing ≥70% particles having particle diameters of 10-50μm to an electrically insulating filler powder containing ≥70% particles having particle diameters of 10-50μm and having a thermal conductivity of ≥5 W/(m×K) at 25°C to obtain the sum of volume fractions of the filler powder and the metal powder of 30-60% and the volume fraction of the metal powder of ≤20%. At least one substance selected from alumina, boron nitride, aluminum nitride, aluminum borate, crystalline silica and zirconium can be used as the filler powder and copper or iron can be used as the metal powder.


Inventors:
HAMAO SATOKAZU
TSUBONE YOSHIFUSA
Application Number:
JP2002312350A
Publication Date:
May 20, 2004
Filing Date:
October 28, 2002
Export Citation:
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Assignee:
YASKAWA ELECTRIC CORP
International Classes:
C08L63/00; C08K3/08; C08K3/22; C08K3/28; C08K3/36; C08K3/38; (IPC1-7): C08L63/00; C08K3/08; C08K3/22; C08K3/28; C08K3/36; C08K3/38