Title:
EPOXY RESIN AND EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2010235821
Kind Code:
A
Abstract:
To provide an epoxy resin having low viscosity, with reduced discoloration and excellent in curability; and to provide an epoxy resin cured article excellent in all of heat resistance, light transmittance, light resistance, crack resistance and water resistance.
This epoxy resin (A) is represented by the general formula (1). The epoxy resin composition includes the epoxy resin and a curing agent (H1) and/or a curing catalyst (H2). The cured article is obtained from the epoxy resin composition. In the formula, R
COPYRIGHT: (C)2011,JPO&INPIT
Inventors:
SAKURAI YOKO
TASHIRO TAKAYUKI
FUKUSHIMA TAKESHI
WAKATSUKI ATSUSHI
TASHIRO TAKAYUKI
FUKUSHIMA TAKESHI
WAKATSUKI ATSUSHI
Application Number:
JP2009086409A
Publication Date:
October 21, 2010
Filing Date:
March 31, 2009
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C08G59/02; C09D163/00; C09J163/00
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