Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2019157025
Kind Code:
A
Abstract:
To provide an epoxy resin composition for injection- or filling-type thick film bonding which enables a construction method for injecting a binder into a clearance gap of the bonding part having a thickness equal to or larger than a certain value, and having an area equal to or larger than a certain value in bond of a structure of structural steel, and gives high bond strength after injection and cure.SOLUTION: An epoxy resin composition comprises: 100 pts.wt. of a solventless room temperature curing epoxy resin composition having a viscosity of 0.05 Pa s or higher and 50 Pa s or lower obtained by blending an epoxy resin which is liquid at room temperature with an aliphatic polyamine-based curing agent; and 0.6-7 pts.wt. of a core-shell type rubber particle and carbon black obtained by blending by a blending ratio of formula (I): a blending amount of a carbon black particle/a blending amount of core-shell type rubber particle=0.05-2.5. The epoxy resin composition is used for bonding a structure of structural steel.SELECTED DRAWING: None
Inventors:
MIYANAGA TOSHIAKI
Application Number:
JP2018047830A
Publication Date:
September 19, 2019
Filing Date:
March 15, 2018
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD
International Classes:
C08L63/00; C08G59/50; C08K3/04; C08L21/00; C09J11/04; C09J11/08; C09J163/00
Attorney, Agent or Firm:
Eisuke Fujimoto
Masayoshi Kanda
Akio Miyao
Nobuyuki Baba
Osamu Hamada
Masayoshi Kanda
Akio Miyao
Nobuyuki Baba
Osamu Hamada