Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3274265
Kind Code:
B2
Abstract:
PURPOSE: To obtain an epoxy resin composition excellent in soldering stress resistance and curability by mixing a specified epoxy resin with a melt mixture of a specific flexible phenolic resin curing agent with a specified cure accelera tor and an inorganic filler.
CONSTITUTION: This resin composition is used for semiconductor sealing and essentially consists of an epoxy resin containing 50-100wt.%, based on the total weight of the epoxy resin, epoxy resin of formula I, a melt mixture prepared by melting a flexible phenolic resin curing agent of formula II (wherein R is P-xylylene; and n is 1-5) and/or formula III (wherein R is a residue derived by removing the two phenolic groups from dicyclopentadienediphenol which is an adduct of dicyclopentadiene with phenol, terpenediphenol which is an adduct of terpene with phenol, cyclopentadienediphenol or cyclohexanonediphenol; and n is 0-4) with tetraphenyl-phosphonium tetraphenylborate as a cure accelerator and an inorganic filler.
Inventors:
Yukuni Katsutoyo
Application Number:
JP31991093A
Publication Date:
April 15, 2002
Filing Date:
December 20, 1993
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L63/00; C08G59/20; C08G59/24; C08G59/40; C08G59/62; C08G59/68; C08K3/00; C08L63/02; H01L23/29; H01L23/31; (IPC1-7): C08G59/24; C08G59/62; C08G59/68; C08K3/00; C08L63/02
Domestic Patent References:
| JP6322073A | ||||
| JP6184280A | ||||
| JP5343570A | ||||
| JP5175369A | ||||
| JP4173828A | ||||
| JP2102217A | ||||
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