Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH04126714
Kind Code:
A
Abstract:
PURPOSE:To obtain the title composition useful for adhesive, sealing resin of electronic parts such as semiconductor, coating compound, etc., comprising a polyfunctional epoxy resin, an epoxy resin curing agent, an inorganic filler and a specific amount of hydrazide, etc., as main components. CONSTITUTION:The objective composition consisting essentially of a polyfunctional epoxy resin (e.g. cresol novolak type epoxy resin), an epoxy resin curing agent (preferably novolak type phenol resin), an inorganic filler (preferably fused silica), preferably 0.1-10wt.% flexibilizer (preferably hydrogenated styrene-butadiene block copolymer) and 0.01-10wt.%, preferably 0.1-5wt.% hydrazide or hydrazine derivative (e.g. phenylhydrazine).
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Inventors:
ANDO TAKAYUKI
HIDA MASAYUKI
ASAI SHINICHIRO
HIDA MASAYUKI
ASAI SHINICHIRO
Application Number:
JP24706590A
Publication Date:
April 27, 1992
Filing Date:
September 19, 1990
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
C08K5/24; C08G59/00; C08G59/56; C08G59/62; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/56; C08G59/62; C08K5/24; C08L63/00; H01L23/29; H01L23/31
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