Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH04337316
Kind Code:
A
Abstract:
PURPOSE:To obtain the title resin composition suitable for sealing material for semiconductor devices, requiring high heat resistance, low water absorption and solder immersion resistance, comprising an epoxidized bis(dihydroxynaphthyl)methane, a phenol resin and an inorganic filler. CONSTITUTION:1,6-Dihydroxynaphthalene is reacted with formaldehyde in the presence of sodium p-toluenesulfonate at 150 deg.C while stirring to give bis(1,6- dihydroxynaphthyl)methane, which is dissolved in epichlorohydrin, heated to 60 deg.C, reacted with 40% aqueous solution of sodium hydroxide, unreacted epichlorohydrin and water are removed, the resulting substance is extracted with an organic solvent to give an epoxy compound shown by the formula. Then an epoxy compound containing 30-100wt.% of the epoxy compound is blended with a phenol resin containing two or more phenolic hydroxyl groups and an inorganic filler to give the objective epoxy resin composition.
Inventors:
KITAHARA MIKIO
MACHIDA KOICHI
KUBO TAKAYUKI
TORIKAI MOTOYUKI
ASAHINA KOTARO
TANAKA JUNSUKE
MACHIDA KOICHI
KUBO TAKAYUKI
TORIKAI MOTOYUKI
ASAHINA KOTARO
TANAKA JUNSUKE
Application Number:
JP11003291A
Publication Date:
November 25, 1992
Filing Date:
May 15, 1991
Export Citation:
Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
C08G59/32; C08G59/00; C08G59/20; C08G59/62; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/32; C08G59/62; H01L23/29; H01L23/31