Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH05339473
Kind Code:
A
Abstract:
PURPOSE:To obtain a resin composition for producing a copper-clad laminates sheet excellent in high-frequency dielectric characteristics, mechanical strength, adhesion to copper foil, moisture resistance and heat resistance. CONSTITUTION:The objective epoxy resin composition consists of (1) an epoxy resin having dicyclopentadiene as a skeleton and (2) a curing agent and (3) a reaction product of an epoxy resin and a phenolic hydroxyl-containing butadiene homopolymer and/or butadiene-vinyl aromatic compound copolymer.
Inventors:
KUNIKATA KENJI
ISHII TOMIYOSHI
ISHII TOMIYOSHI
Application Number:
JP16986992A
Publication Date:
December 21, 1993
Filing Date:
June 05, 1992
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
C08G59/20; C08G59/00; C08G59/26; C08G59/40; C08G59/62; C08L63/00; H05K1/03; (IPC1-7): C08L63/00; C08G59/20; C08G59/40; C08L63/00