Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0597967
Kind Code:
A
Abstract:
PURPOSE:To obtain an epoxy resin composition, containing a specific phenolic resin and an epoxy resin in a prescribed proportion, having a low elastic modulus, linear expansion coefficient and water absorptivity and excellent in heat and solder crack resistance. CONSTITUTION:The objective composition containing (A) a phenolic resin expressed by the formula [(n) is >=0; R is alkyl; X1 and X2 are halogen or hydrogen] and (B) an epoxy resin prepared by epoxidizing the phenolic resin with an epihalohydrin, etc. Both components are contained in amounts of 0.5-1.5mol hydroxyl group in the component (A) based on 1mol epoxy groups in the epoxy resin. The composition is suitable as a sealing material for semiconductors.
Inventors:
ANDO SHINJI
FUKUI YUKIO
IIMURO SHIGERU
FUKUI YUKIO
IIMURO SHIGERU
Application Number:
JP26184791A
Publication Date:
April 20, 1993
Filing Date:
October 09, 1991
Export Citation:
Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
C08G59/20; C08G59/00; C08G59/32; C08G59/62; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/20; C08G59/32; C08G59/62; H01L23/29; H01L23/31