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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH06157723
Kind Code:
A
Abstract:

PURPOSE: To obtain an epoxy resin composition containing an epoxy resin and a specific curing agent, having high mechanical strength, low stress and excellent crack resistance, heat resistance, fluidity, molding workability, transparency, light-transmittance and appearance and useful for the sealing of semiconductor, etc.

CONSTITUTION: This resin composition is produced by compounding (A) 100 pts.wt. of an epoxy resin such as bisphenol-type epoxy resin with (B) preferably 40-200 pts.wt. of a curing agent consisting of one or more kinds of silicone- modified acid anhydrides expressed by formula I [R1 is group of formula II; R2 is H, (substituted)univalent hydrocarbon group, hydroxyl group, alkoxy or alkenyloxy; (a) is 0-3; (b) is 0-2.5; a+b is ≤3].


Inventors:
Shiobara, Toshio
Futatsumori, Koji
Arai, Kazuhiro
Ino, Shigeki
Application Number:
JP1992000341385
Publication Date:
June 07, 1994
Filing Date:
November 27, 1992
Export Citation:
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Assignee:
SHIN ETSU CHEM CO LTD
International Classes:
C08G59/42; C07F7/08; C07F7/21; C08G59/40; C08K5/54; C08K5/5419; C08L63/00; (IPC1-7): C08G59/42; C08G59/42; C08K5/54; C08L63/00
Attorney, Agent or Firm:
小島 隆司