PURPOSE: To obtain an epoxy resin compsn. excellent in resistances to heat and moisture, adhesive properties, and moldability by compounding a novolac resin, dicyandiamide, and a specific halogenated epoxy resin.
CONSTITUTION: An epoxy resin compsn. comprises a novolac resin, dicyandiamide, and an epoxy resin of the formula (wherein m and n are each an integer of 1 or higher; R0 is a glycidyl ether group or a hydroxyl group provided 10-100mol% of all the Rg groups in the resin are glycidyl ether groups; R1 and R2 are each H or linear alkyl; and X1 and X2 are each H or halogen). The compsn., excellent in heat resistance, moisture resistance, and adhesive properties, can give a mono-or multilayered printed circuit board excellent in reliability during parts mounting and in long-term reliability of insulation when used as the material of the printed circuit board.
OZAWA SATORU
EKUSA SHIGERU
