To obtain the subject composition having a sufficient pot life, rapidly curable at a low heating temperature, capable of developing a strong bond strength, useful as an adhesive, a sealing agent, etc., by including an epoxy resin and a specific polythiol.
This composition comprises (A) an epoxy resin (e.g. one having 43-1,000 epoxy equivalent) such as a bisphenol type epoxy resin and (B) a polythiol containing three or more mercapto groups in one molecule and consisting only of carbon atoms, sulfur atoms and hydrogen atoms [e.g. a compound of the formula; R-(SH)m ((m) is 3-10; R is a 3-18C hydrocarbon (m)- functional group) having ≥150°C boiling point]. Preferably the composition has the equivalent ratio of the total amount of the mercapto groups of the component B/the total amount of the epoxy groups of the component A of 0.5/1.5 to 1.5/0.5.
SATO KAZUYA
UENO KATSUTOSHI
RI GUN
Next Patent: COPOLYMER HAVING THIOPHENE STRUCTURE AND ITS STRUCTURE