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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS5450596
Kind Code:
A
Abstract:

PURPOSE: To prepare an epoxy resin composition rapidly curable without foaming, by compounding the resin with a tetra-substituted ammonium-tetra-substituted borate compound prepared by using a specific tertiary amine, etc., as a curing accelerator.

CONSTITUTION: A tetra-substituted ammonium-tetra-substituted borate compound of the formula [R1WR4 are H, alkyl, hydroxyl or (substituted) phenyl; R5 is (substituted) phenyl] is prepared by reacting a tetraphenyl boron compound with a tertiary amine or a quaternary ammonium compound having a higher boiling point than the molding temperature (e.g. 150°C), e.g. triphenylamine, dimethylaminoethanol, etc.. The compound is added to an epoxy resin as a curing accelerator together with a curing agent


Inventors:
KITAMURA MASAHIRO
SUZUKI HIROSHI
Application Number:
JP11674877A
Publication Date:
April 20, 1979
Filing Date:
September 30, 1977
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C08G59/00; C08G59/68; (IPC1-7): C08G59/68