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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS5821418
Kind Code:
A
Abstract:

PURPOSE: An epoxy resin composition, containing an aluminum complex having a slaicylic ester derivative as a ligand and an organosilicon compound having silanol hydroxyl groups, etc. as a catalyst, having improved storage stability, and capable of giving a cured article having improved electrical characteristics even at a low temperature.

CONSTITUTION: An epoxy resin composition prepared by incorporating (A) an aluminum complex having at least one salicylic ester derivative as a ligand, e.g. the compounds of formulasI, II, etc., and (B) 0.01W5pts.wt., based on 100pts.wt. epoxy resin, organosilicon compound having silanol hydroxyl or hydrolyzable groups, preferably diphenylsilanediol, as a catalyst in an amount of 1W5 equivalents silanol hydroxyl or hydrolyzable groups in the compoent (B) based on one mole aluminum complex of the component (A).

EFFECT: A high catalytic ability even at a relatively low temperature and good compatibility with other materials, convenient for preparing solventless varnishes.


Inventors:
HAYASE SHIYUUJI
SUZUKI SHIYUICHI
Application Number:
JP11843381A
Publication Date:
February 08, 1983
Filing Date:
July 30, 1981
Export Citation:
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Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
C08G59/00; C08G59/40; C08G59/68; C08G59/70; C08L63/00; (IPC1-7): C08G59/40; C08G59/68
Attorney, Agent or Firm:
Noriyuki Noriyuki